NULL, in which case default attributes are used: the created thread is joinable (not detached) and has an ordinary (not realtime) scheduling policy.Then you can run the same directfb application from X
For performance analysis, and final testing, I would recommend using virtual console, and not X, because thats the way directfb will finally work...
What is the best way to run a debugger to debug a directfb program?
One choice is to open an xterm into the machine supporting directfb, and
run gdb in the xterm. If you can see the screen of the directfb machine,
and the Xserver's screen you can efficiently debug.
What if you only have the directfb machine to work on?
If I run gdb on a directfb program directly on the machine with
directfb, then as soon as directfb starts up, gdb loses control of the
keyboard and screen (and then I need to actually kill the program via
an xterm). Is there a clever way to allow use of gdb directly on a
machine running directfb?
Any ideas appreciated.
Regards
Colin Newell
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硬件反向工程(Reverse Engineering RE)
包括以下几种形式:
Product tear-downs identify the product, package, internal boards, and components
System level analysis analyse operations, signal paths, and interconnections
Circuit extraction delayer to transistor level, then extract interconnections and components to create schematics
Process analysis examine the structure and materials to see how it is manufactured, and what it is made of.
第一种即常见的拆解和pcb抄板. 第二种则主要是借助逻辑分析仪来分析硬件的工作时序或协议. 第三种则主要是得到集成电路的原理图或硬件逻辑. 第四种则是深入分析晶体管的制造工艺以及进行失效分析等.
硬件反向工程领域知名公司: 国外为ChipWorks和Semiconductor Insights(SI)，国内有上海圣景微电子和北京芯愿景. (行业介绍可以看:IIC-China：中国两大反向工程公司相见言欢，谜底何在)
集成电路的反向工程领域(相关介绍参见:正确实施反向工程，有利于提高芯片设计技术),通常的操作有:
常的操作有:
封装去除(decapsulate/decap):
用酸将封装去除以便提取晶粒
层次去除(delayer):
除去已分析的层或无关层
芯片染色:
为了区分器件类型，需要对衬底进行染色
芯片拍照
用光学显微镜或电子显微镜对芯片进行拍照.
电路提取
借助自动化软件对照片进行电路分析提取
封装去除的一些照片:
完全decap以后晶粒(die)放大图:
其中die所在空腔叫 cavity. die边缘连出的线上叫banding wire. die所依附的底座叫substrate. Substrate四周的片状条叫lead frame. Lead frame连到封装上的pin(这点图上没有).
(AMD AM29X305ADC MCU 图片来源于http://diephotos.blogspot.com/,该页面有更多类似精美的图片)
反向工程的全过程介绍: Safenet iKey 2032 In-depth Look Inside (该网站上还有很多类似的反射工程例子)
查找资料当中遇到其它一些单词:
Epoxy 环氧树脂,在以前一般是把die直接附着在pcb上,这时用epoxy把die保护起来. 计算器pcb板上的那团黑色的物质就是(小时候我一直没想明白那里面包着的是什么东西).
Wafer 晶圆